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单原子Bi修饰铜合金实现电催化还原CO2为C2+产物的C-C偶联
作者:小柯机器人 发布时间:2023/5/31 17:47:14

中国科学院大连化学物理研究所章福祥团队报道了单原子Bi修饰铜合金实现电催化还原CO2为C2+产物的C-C偶联。相关研究成果发表在2023年5月30日出版的《德国应用化学》。

单原子合金(SAA)催化剂最近已被探索用于促进各种多相催化,但其在涉及C-C偶联的二氧化碳(CO2)选择性电催化还原为多碳(C2+)产物方面仍未被探索。

该文中,研究人员报道了一种单原子Bi修饰的Cu合金(表示为BiCu-SAA)电催化剂,它可以有效地调节CO2还原为C2+产物的选择性,而不是以前的C1产物。与纯铜纳米颗粒或Bi纳米颗粒修饰的Cu纳米复合材料相比,BiCu-SAA催化剂表现出显著优异的C2+产物选择性,最佳法拉第效率(FE)为73.4%,并且在流动池系统下,其结构和性能可以在400mA cm-2的电流密度下很好地保持。基于原位表征和密度泛函理论计算,发现BiCu-SAA在电催化反应过程中有利于CO2的活化和随后的C-C偶联,这应该是其非凡的C2+选择性的原因。

附:英文原文

Title: Single Atom Bi Decorated Copper Alloy Enables C-C Coupling for Electrocatalytic Reduction of CO2 into C2+ Products

Author: Yucheng Cao, Suya Chen, Shuowen Bo, Wenjun Fan, Jiangnan Li, Chunmei Jia, Zhen Zhou, Qinghua Liu, Lirong Zheng, Fuxiang Zhang

Issue&Volume: 2023-05-30

Abstract: Single atom alloy (SAA) catalysts have been recently explored for promotion of various heterogeneous catalysis, but it remains unexplored for selective electrocatalytic reduction of carbon dioxide (CO2) into multi-carbon (C2+) products involving C-C coupling. Herein we report a single-atomic Bi decorated Cu alloy (denoted as BiCu-SAA) electrocatalyst that could effectively modulate selectivity of CO2 reduction into C2+ products instead of previous C1 ones. The BiCu-SAA catalyst exhibits remarkably superior selectivity of C2+ products with optimal Faradaic efficiency (FE) of 73.4% compared to the pure copper nanoparticle or Bi nanoparticles-decorated Cu nanocomposites, and its structure and performance can be well maintained at current density of 400 mA cm-2 under the flow cell system. Based on our in-situ characterizations and density functional theory calculations, the BiCu-SAA is found to favor the activation of CO2 and subsequent C-C coupling during the electrocatalytic reaction, as should be responsible for its extraordinary C2+ selectivity.

DOI: 10.1002/anie.202303048

Source: https://onlinelibrary.wiley.com/doi/10.1002/anie.202303048

期刊信息

Angewandte Chemie:《德国应用化学》,创刊于1887年。隶属于德国化学会,最新IF:16.823
官方网址:https://onlinelibrary.wiley.com/journal/15213773
投稿链接:https://www.editorialmanager.com/anie/default.aspx