近日，比利时鲁汶大学的Kris Myny及其研究团队取得一项新进展。他们报道了由独立代工厂生产的用于柔性薄膜电子产品的多项目晶圆概念。相关研究成果已于2024年4月24日在国际权威学术期刊《自然》上发表。

该研究团队展示了一个稳定的、高产量的TFT平台，用于两种主流TFT技术的无晶圆制造，即基于晶圆的非晶铟镓锌氧化物和基于面板的低温多晶硅，这两种关键的TFT技术适用于柔性衬底。研究人员在这两种技术中设计了标志性的6502微处理器，作为演示和扩展多项目晶圆方法的用例。启用TFT的代工模型，作为硅CMOS技术的类比，可以加速基于这些器件的应用和技术的增长和发展。

据悉，柔性和大面积电子产品依靠薄膜晶体管(TFTs)来制造显示器、大面积图像传感器、微处理器、可穿戴医疗贴片、数字微流体等。虽然硅基互补金属氧化物半导体(CMOS)芯片是在一个晶圆上使用多个芯片制造的，而且多项目晶圆概念可以在同一个晶圆内聚集各种CMOS芯片设计，但TFT制造目前缺乏一种完全验证的通用设计方法。这增加了制造基于TFT的柔性电子产品的成本和复杂性，减缓了它们与更成熟应用的集成，并限制了代工厂可实现的设计复杂性。

附：英文原文

Title: Multi-project wafers for flexible thin-film electronics by independent foundries

Author: eliker, Hikmet, Dehaene, Wim, Myny, Kris

Issue&Volume: 2024-04-24

Abstract: Flexible and large-area electronics rely on thin-film transistors (TFTs) to make displays, large-area image sensors, microprocessors wearable healthcare patches, digital microfluidics and more. Although silicon-based complementary metal–oxide–semiconductor (CMOS) chips are manufactured using several dies on a single wafer and the multi-project wafer concept enables the aggregation of various CMOS chip designs within the same die, TFT fabrication is currently lacking a fully verified, universal design approach. This increases the cost and complexity of manufacturing TFT-based flexible electronics, slowing down their integration into more mature applications and limiting the design complexity achievable by foundries. Here we show a stable and high-yield TFT platform for the fabless manufacturing of two mainstream TFT technologies, wafer-based amorphous indium–gallium–zinc oxide and panel-based low-temperature polycrystalline silicon, two key TFT technologies applicable to flexible substrates. We have designed the iconic 6502 microprocessor in both technologies as a use case to demonstrate and expand the multi-project wafer approach. Enabling the foundry model for TFTs, as an analogy of silicon CMOS technologies, can accelerate the growth and development of applications and technologies based on these devices.

DOI: 10.1038/s41586-024-07306-2

Source: https://www.nature.com/articles/s41586-024-07306-2