近日，华中科技大学的杨荣贵&刘修良及其研究团队取得一项新进展。经过不懈努力，他们成功们建立微结构表面液膜沸腾的传热模型。相关研究成果已于2024年3月8日在国际知名学术期刊《国家科学评论》上发表。

本工作通过考虑芯顶蒸发和芯内核沸腾，建立了一个热流体动力学模型，旨在同时预测了HTC和CHF。研究人员采用微层蒸发理论对核沸腾进行了建模，定义了统一的尺度因子来表征微层面积随热流密度的变化。研究发现，缩放因子η与排出气泡的结构无关，仅需通过数次测量即可确定。

这使得该研究的模型适用于各种微结构表面(包括微柱、微粉和微孔)的液膜沸腾传热预测。这项工作不仅深入揭示了相变传热的基本机制，还为热管理中微结构表面的优化设计提供了有力的工具。

据悉，高传热系数(HTC)和临界热流密度(CHF)在液膜沸腾中得以实现，这是通过耦合振动蒸汽气泡与毛细管液膜完成的，因此，在高功率电子热管理领域引起了广泛关注。尽管在实验方面取得了一些进展，但目前仍缺乏一个高精度的液膜沸腾传热模型。

附：英文原文

Title: A heat transfer model for liquid film boiling on micro-structured surfaces

Author: Li, Pengkun, Zou, Qifan, Liu, Xiuliang, Yang, Ronggui

Issue&Volume: 2024-03-08

Abstract: High heat transfer coefficient (HTC) and critical heat flux (CHF) are achieved in liquid film boiling by coupling vibrant vapor bubbles with a capillary liquid film, which has thus received increased interest for thermal management of high-power electronics. Although quite some experimental progresses have been made, there lacks a high-fidelity heat transfer model for liquid film boiling. This work develops a thermal-hydrodynamic model by considering both evaporation atop the wick and nucleate boiling inside the wick to simultaneously predict the HTC and CHF. Nucleate boiling is modeled with microlayer evaporation theory, where a unified scaling factor is defined to characterize the change of microlayer area with heat flux. The scaling factor η is found to be independent of wicking structure and can be determined from a few measurements. This makes our model universal to predict the liquid film boiling heat transfer for various micro-structured surfaces including micropillar, micropowder, and micromesh. This work not only sheds light on understanding fundamental mechanisms of phase-change heat transfer, but also provides a tool for designing micro-structured surfaces in thermal management.

DOI: 10.1093/nsr/nwae090

Source: https://academic.oup.com/nsr/advance-article/doi/10.1093/nsr/nwae090/7624671?searchresult=1